Seminar on Shenzhen-HK Innovation Circle Sponsorship Policy

In order to facilitate innovation and technology development between Shenzhen and Hong Kong, the Shenzhen Government has recently announced a Sponsorship Policy to encourage collaboration between Hong Kong and Shenzhen companies. A briefing session was conducted in Hong Kong Science Park on 12 July 2010.

There are three schemes in different districts:
(1) Shenzhen-HK Innovation Circle – Shenzhen-HK Project Collaboration Sponsorship Scheme (Shenzhen) -深港創新圈項目資助計劃 (深圳市)
(2) Shenzhen-HK Innovation Project Collaboration Sponsorship Scheme (Nanshan District) -深港創新合作項目資助計劃 (南山區)
(3) Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) -粵港科技合作資助計劃 (香港)

For Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS), the following steps of application were shown.
1．Application qualification
http://www.itf.gov.hk/l-sc/TCFS.asp
2．Application Items
http://www.itf.gov.hk/l-sc/tcfs_themes.asp
3．Application Form (Sample)
http://www.itf.gov.hk/l-sc/forms.asp
粵港科技合作資助計劃- 甲(二)類項目
粵港科技合作資助計劃 – 丙類項目
4． Online Register
http://www.itf.gov.hk/l-sc/Reg_Guide.asp
https://www3.itf.gov.hk/Administrator/reg_PI.asp
5． Online Application System：創新科技署基金管理系統，
https://www3.itf.gov.hk/

Eventhough the deadline of above funding would be due on 16 or 20 July 2010, we can consider to apply in next year.

For more information:
Shenzhen-HK Innovation Circle – Shenzhen-HK Project Collaboration Sponsorship application guideline (In Chinese) 深港創新圈項目資助計劃 (深圳市)
http://stias.szsitic.gov.cn/resstias/userfiles/file/zhinan/sgcxq.htm
深港創新合作項目資助計劃 (南山區)
http://www.szns.gov.cn/kjj/xwdt/tzgg/2010042597856.shtml
Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) (创新及科技支援计划 - 粤港科技合作资助计划)
https://www.itf.gov.hk/l-eng/TCFS.asp#How