HKSTP & HKQAA Seminar on Green Work & Green World

The Seminar entitled "Green Work, Green World: Empowering the Business Sector to End Climate Change Crisis" was organized by Hong Kong Science & Technology Parks Corporation (HKSTPC) and supported by Hong Kong Quality Assurance Agency (HKQAA) on 30 Aug 2013. The seminar aimed to raise industry awareness towards climate change and introduce various tools that empower companies to jointly end climate change crisis.

In the beginning, I gave a welcome speech and indicated that sustainability was very important in every companies and introduced different parties contributed in the seminar.

Mr. Coleman Tse (General Manager at HKQAA) gave an opening remark. He mentioned an integrated audit named "Energy Cum Audit" which combined with Energy and Carbon audit.

The first speaker was Ms. Caroline Ma (Auditor, Operations Branch, HKQAA) and her topic named "Climate Change & Carbon Smart Program".

Ms. Ma mentioned a global challenge and required actions to reduce greenhouse gas (GHG) emissions. The concentration of CO2 from pre-industrial to present were changed from 280 ppmv to 384 ppmv. Some observations of global warming in Hong Kong were shown in the following diagram.

Then She introduced HKQAA CarbonSmart Program Verification Process which enchanced the brand and corporate reputation by demonstrating commitment to CSR and carbon reduction. During application submission, organization applied for both HKQAA scheme and HKPC for CarbonSmart Fund, as well as, expected schedule of having Carbon Verification Report. The next step was on-site verification and confirmation of that result included carbon inventory figure. When every steps were complied, HKQAA would approve for issuance of Carbon Verification Report.

The second speaker was Mr. Patrick Ho (Consultant, Automotive and Electronics Green Manufacturing & Environmental Consultancy, HKPC) and his presentation named "CarbonSmark" Program.

Firstly, Mr. Ho briefed local trend of carbon management. Based on "Climate Change Business Forum Survey 2012, it collected the percentage of concern on Electricity Cost (79%), Environmental Resource Leakage (78%), Climate Change (77%), etc.

Then he mentioned our Office's Carbon Footprint that the highest portion was Office Area Cooling & Lighting (58%), Office ICT Equipment (14%), Data Centre Cooling & Lighting (10%) and Data Centre ICT Equipment (9%).

Finally, Mr. Ho introduced CarbonSmart which was a government funded project aimed to encourage and sustain industry effort on carbon audit and reduction to shape a low carbon future. The funding source was from Environment and Conservation Fund. HKPC performed a Carbon Audit Pilot Fund and targeted for 200 companies across 4 business sections (i.e. Office-based operations, Retail, Catering & Others). The fund subsidized up to 50% of the approved cast of carbon audit and the ceiling amount is HK$30,000 for each applicant.

The third speakers were Mr. Howard Yeung (Senior Technical Service Manager, ICC) and Mr. Mick Lai (Property & Facility Manager, ICC) and their topic was "Low Carbon Office in ICC". Mr. Mick Lai introduced the background and mission of their company and Eco-friendly was one of goals.

Then they introduced Low Carbon Office reducing 16,583 CO2 carbon emission annually, and approximately 14% overall energy saving annually, as well as, 39% lighting saving annually. The details of lighting system saving were showed as following table.

Other measures were also mentioned such as Smart Printing & Photocoping (e.g. Using smart card for paper printing like University Library), Water cooled Air-conditioning System, Efficient Lift System, and Building Management System, etc. MVAC System, Lift & Escalator System and Electrical System contributed were identified as significant energy sources. After implemented ISO 50001 Energy Management System, overall electricity efficiency was improved. Electricity consumption was reduced 11% in average comparison between 2012 and 2013 (Jan-Jun).

After the presentation, we took a group photo for memory.

Ms. Danna Pan (Deputy General Manager, AirStar Environment Technology Group (HK) Ltd.) prepared a site visit to Low Carbon Office in Science Park. When we arrived the office, Mr. Otto Tse (General Manager, AirStar Environment Technology Group (HK) Ltd.) introduced their Radiant Ceiling and Fresh Air System (RCF).

The following diagram showed the different of heat transfer paths between RCF and Convection Air-conditioning. We were comfortable in the meeting room for more than 20 people.

Then Mr. Otto Tse showed their RCF system in plant room on-site.

Reference:HKSTPC - http://www.hkstp.org/
HKQAA - http://www.hkqaa.org

Symposium on High-performance and Emerging Technologies

The Symposium on High-performance and Emerging Technologies - Green Power Electronics and 3D Packaging was co-organized by Hong Kong Applied Science and Technology Research Institute (ASTRI), Hong Kong Science and Technology Parks Corporation (HKSTPC), Centre for Smart Energy Conversion and Utilization Research, CityU and Technical Committee on High-performance and Emerging Technology of IEEE Power Electronics Society (PELS) on 30 August 2013. HKSTPC supported 3D IC technology through new laboratories establishment (e.g. 3D SIP laboratory and 3D WLP laboratory). The symposium was summarized as follows.

Prof. Henry Chung (Chair, TC6 of IEEE Power Electronics Society) gave a welcoming remarks. He introduced PELS and brief the program. He added the society would arrange more technical events on Power Electronics in near future.

The first speaker was Ms. Rozalia Beica (CTO, Advanced 3D Packaging and Semiconductor Manufacturing Business Unit Manager, Yole Development) and her topic entitled "Advanced 3D Packaging Market Trends and Applications". Ms. Beica presentation included advanced packaging overview, 2.5 & 3D packaging, market forecasts and IP activities.

Ms. Becia said about 16% of overall semiconductor IC wafers were manufactured with packaging features (e.g. bumping, RDL, TSV, etc...) processed at the wafer-scale in 2012.

There were three types of 3D IC Market Drivers included Performance driven (e.g. CPU, DRAM), Form Factor-driven (e.g. Sensors, RF-SIP) and Cost-driven (e.g. FPGA). Moreover, 3D TSV applications were mentioned such as Imaging, MEMS & Sensors, RF, Power, Analog & Mixed Signal, and Logic 3D-SiP/SoC. The following diagram showed different Markets for 3D ICs.

Then Ms. Becia briefed different characteristics of Patents Filing for 3D IC Technology. Patents in domain mainly filed by firms or universities that located in USA was 56% and Korea was 18%. These patents were mainly extended in USA, China, Korea, Taiwan and Japan. Top 10 inventors for 3D IC Patents were belong to TSMC, StatsChipPAC, Micron and Samsung. Finally, she concluded that a significant growth for 2.5 / 3D IC and other TSV based applications were observed.

The second speaker was Mr. Farhang Yazdani (President and CTO, BroadPak Corporation) and his presentation named "Advances in 2.5D/3D Silicon Interposer Packaging Technology". Mr. Yazdani introduced 2.5D / 3D packaging structures and TSV synthesis.

The 2.5D and 3D  Silicon Interposer were explained.  After that he introduced silicon interposer formation process and signaling. The following diagram described different End-to-End Pathfinding for 3D IC included Thin and Rigid Interposer Flow.

Finally, he summarized the challenges on 2.5D / 3D as follows:
I) Thin Interposer included Supply Chain Infrastructure, Thermal-Stress Management, Reliability, IO Standardization, Pathfinding Methodology, Test Methodology and Cost;
II) Rigid Interposer included IO Standardization, Pathfinding Methodology and Test Methodology.

Mr. Chang-Sheng Chen (Manager, Advances Packaging Technology Division of Electronics and Optoelectronics Research Laboratory, Industrial Technology Research Institute, Taiwan (ITRI)) was the third speaker and his presentation title was "An Introduction of Development Project Power Module Packaging in ITRI". Mr. Chen shared different projects on Power Module packaging. Then he introduced their self-developed equipment for Power Module Packaging.

Mr. Chen briefed three projects which demonstrated the trend going to high power and integration. He concluded that high temperature stable conductive joint was one of the focuses in the application of power modules. Dielectrics with higher thermal conductivity were also be the key materials. At the end, he introduced Wide Band Gap Power Electronics Consortium (WPEC) for more information. (http://wpec.org.tw/eng/)

Dr. Daniel Shi (R&D Director, ASTRI) was the forth speaker and his topic was "3D High Power IGBT Module". Dr. Shi introduced ASTRI's Through-Silicon-Via (TSV) Roadmap firstly. And then he summarized their 3D Packaging Design Capability.

ASTRI's TSV process capability was also discussed and it included "Wafer Thinning & Thin Wafer Handling", "Via Formation & Isolation", "Barrier & Seed Layer", "Via Filling & Bumping" and "3D Integration for 3D Systems". The following diagram demonstrated TSV for different products.

Finally, Dr. Shi briefed Insulated Gate Bipolar Transistor (IGBT) feature and applications included Electric Vehicle. The following diagram showed the evolution of IGBT technologies. He concluded High-end IGBT module development faced many technical challenges especially on interconnect long-term reliability, module harsh environment failure and super high heat dissipation.

Dr. HL Yiu (Head of Electronics Cluster, BDTS, HKSTPC) was the last speaker in the morning session and his topic named "Infrastructure and Support at Hong Kong Science Park for the Development of 3D IC Technology". 

Dr. Yiu introduced HKSTPC new laboratories named "3D SiP Lab" and "3D WLP Lab"; as well as achieved the status of National IC Design Base.

In addition, the existing laboratories and new laboratories were completed the whole IC testing service as following diagram. Dr. Yiu mentioned four 3D IC challenges included Design, Testing, Reliability and Analysis.

Because I was in-charge for another seminar and missing the afternoon session.

Prof. Ricky S.W. Lee (Professor of Mechanical Engineering and Director of Centre for Advanced Microsystems Packaging, HKUST) was the speaker in afternoon session and his presentation entitled "Emerging Trends of Packaging Structure and Interconnection for Microelectronics"

Panel Discussion chaired by Prof. Henry Chung.

Reference:
HKSTPC - http://www.hkstp.org/HKSTPC/en_html/en_index.jsp
ASTRI - http://www.astri.org/main/

EngD Society visit to TDK and Science Park Laboratories

CityU EngD Society arranged a technical visit to TDK China Co., Ltd., and Science Park Laboratories on 28 Aug 2013. TDK (China) Co., Ltd. is the Japanese TDK Corporation’s operating entity in Greater China Region. And SAE Technology Centre in Science Park, which is the first stop of the visit, is the headquarters and R&D Centre of TDK’s wholly-owned subsidiary – SAE Magnetics (http://www.sae.com.hk) who is the only independent manufacturer of the world for magnetic recording heads used in hard disk drives. In addition to magnetic recording heads, SAE has also expanded to the areas of Optical Communication Components. Hong Kong Science Park develops and provides research and development (R&D) support services to assist technology companies in FIVE clusters included Biotechnology, Electronics, Green Technology, Information Technology and Telecommunications, as well as, Precision Engineering. Each cluster has their own laboratories or support centres (http://lab.hkstp.org).

In the beginning, Dr. Raymond Leung (Chairman & CEO, TDK China Co., Ltd.; and EngD cohort 2005) gave use an overview the development of SAE and TDK in China. He said technology advance edge was the key of survive, so they had several national standard material laboratories for R&D. During our discussion, Raymond pointed out some opportunities such as their HD technology employed for Cloud Computing under Data Centre storage aspect, Electric Car battery. Amperex Technology Limited (ATL) and EPCOS were two of subsidiary companies which R&D performed in Hong Kong.

Our vice chairman Dr. Herbert Yeung presented a souvenir to Dr. Raymond Leung.

Then Mr. Horris Leung (TDK) introduced TDK China Co., Ltd. history and products to us. TDK has more than 70 years revolution and development since 1932. They had three types of product stated "Passive Components", "Magnetic Application Products" and "Other".

The following diagram demonstrated different products in TDK. Horris pointed out that a Car in the centre of the diagram indicated that vehicle electronic would be key market. They would focus on electric vehicle battery development.

Some product samples were showed to us included Wafer of Magnetic Recording Head (4"), Hard Disk Drive and Tablet Li-Battery.

After that Horris led us to visit TDK China testing laboratories. There were many set of tester for Dynamic Electric/Performance Testing. All testing would be performed in Clean Room. Since particle, temperature and humidity were significant parameters, some testers located in a temperature chamber or Dry Room both under clean room environment for testing.

We took a group photo in front of TDK logo.

The second part of technical visit was led by myself. First laboratory named Wireless Communications Test Laboratory and I introduced the 3GPP tester which was inside shield room.

In reliability laboratory, I briefed different type of temperature and humidity chambers.

Then we visited a new laboratory named 3D SIP laboratory. All equipment were in 10k class clean room for wafer / probe test and packaging pilot test.

We took a group photo in front of 3D SIP Laboratory

The last station was the building Green 18 and it was Hong Kong National High-Tech Industrialisation (Partner) Base For Green Technology.

I mentioned different green technologies which employed in Green 18 and their efficiency. Then we visited the green roof of the building.

Dr. Amie Lai (Chairlady, EngD Society) presented a souvenir to me.

At the end, we took a group photo in front of Golden Egg for memory.

EngD Society Information:
Board Members 2013 are:
Chairlady - Ms. Amie Lai (2004)
Vice-chairman - Dr. Herbert Yeung (2004)
Secretary - Dr. Lotto Lai (2005)
Treaturer - Dr. Calvin Chiu (2005)
Dr. Rocky Lam (2006)
Dr. PM Lai (2008)
Dr. Dave Lo (2005)
Dr. WT Chan (2004)

Reference:
CityU Engineering Doctorate Society - http://www.engd.org/content/Introduction.aspx
Engineering Doctorate (Engineering Management) - http://www.cityu.edu.hk/seem/prg-engd.htm
CityU's Engineering Doctorate (Engineering Management) Programme 2013 - http://www.sgs.cityu.edu.hk/programme/ENGD(EM)

ASQ InfVoices - Quality Professional Training

Mr. Paul Borawski (CEO, ASQ) discussed the Professional Training and survey result from ASQ’s Global State of Quality Research as the ASQ Influential Voices Topic in August. It found that (1) organizations which govern quality with a centralized group are roughly 30 percent more likely to provide quality training to staff than organizations where a senior executive governs the quality process. On the other hand, it also found that (2) the majority of organizations have a fairly narrow training scope by providing quality-related training to staff directly involved in the quality process. Only a handful of organizations provide quality training to all staff. 

Quality Professionals believe that everyone would be competence through effective training.

I agree the research results on quality training survey in both (1) and (2). I would like to share my case. In my division, quality system unit is a centralized group to govern quality management and responsible to nominate staff for quality training regularly. In other divisions, only senior managers drive the quality management, they had seldom to assign staff for quality training.

However, I observed that most of quality trainings are fairly narrow scope that are focused on ISO certification awareness and internal auditor included ISO 9001, ISO 27001, OHSAS 18001, ISO 14001 and ISO 50001, indicating that companies focused on tangible management outcome such as certifications. Other type of quality trainings such as On-the-job, workshop and role play are most effectiveness but costly. If only senior executives govern the quality process, they are more interested in "Earnings before interest, taxes, depreciation and amortization" (EBIDTA) rather than overall quality management competency.

I had invited by TUV SUD to be one of speakers in Open Forum on "How to improve the training effectiveness in cost-effective way" in 2008 and details in reference.

Reference:
TUV Open Forum on “How to improve the training effectiveness in cost-effective way” - http://qualityalchemist.blogspot.hk/2008/07/tuv-open-forum-on-how-to-improve.html

ISI Seminar & Summer Networking 2013

I attended the Institute of Systematic Innovation, HK (ISI) Seminar & Summer Networking on 24 Aug 2013. The activity jointly organized by ISI and Department of Systems Engineering and Engineering Management (SEEM), CityU. The Hong Kong Institution of Engineers - Manufacturing & Industrial Division (HKIE - MID) was a supporting organization.

The first speaker was Mr. Kenny Chow (Executive Director, Kopin Corporation) and his topic entitled "MicroDisplay Technology by Kopin".

Mr. Chow shared the application of Kopin's technology into Video Eyeware and camera products for the customer market. Some application products included 3D Video Eyewear, First Person View (FPV) Radio Control, Night Vision, Video Recording Glasses, Heart Rate Monitor Glasses, Google Glass, etc.

Then he introduced Binocular Display Module (BDM) as the Plug-and-Play Solution for Video Eyewear. BMM considered the Interpupuillary Distance (IPD), Exit Pupil Size and Population. The background optical theory was showed in the following diagram. If the lens set to 400 degree, people with 300 to 500 degree short sighted could use this product.

At the end, Mr. Chow shared his view on Technology Innovation. He said the business model to push the product from material technology to Human Technology in the past was not suitable now. It should be started from Human Technology and pulled the demand from Material Technology.

He explained the pull model was needed because of the technology over flow. Eventhough you had a new technology to fit market demand, it was not enough because many other substitution technologies were existing.

Dr. Micheal Li (Chairman, ISI) presented a souvenir to Mr. Kenny Chow.

Dr. Victor Lo (ISI) was the second speaker and his presentation named "The development of a new innovation model in Hong Kong". In the beginning, Victor introduced the Kano Attribute Model and briefed the "Excitement Quality" as result of innovation product. In the Industrial Engineering, Efficiency and Effectiveness were focused which included people, money, knowledge, information, equipment, energy, material and process.

Then Dr. Victor Lo defined the innovation which needs from users were fulfilled by new things plus function(s), then created value. His another comment on Innovation "Innovation is beyond the scope of own expertise, removing their prejudices to learn from the outside world." (In Chinese "創新是超越自己的專長範疇，拋開成見向外面的世界學習。")

Dr. Lo mentioned there were two sects named "Human Centered Innovation" and "TRIZ - Theory of Inventive Problem Solving". Then Dr. Lo analyzed their strange and weakness. After that Dr. Lo introduced his Innovative Total Quality Improvement (iTQI) model which incorporated two Innovation sects as follow diagram.

He developed 50 flash cards to assist idea generation.

The model was implemented through 50 flash cards under the Innovation Map.

At the end, Dr. Lo concluded innovation caused butterfly effect that "Small Innovation Today, Big Leap Tomorrow" (今天的小創新，明天的大飛躍。).

Reference:
Institute of Systematic Innovation, HK - http://www.isi.org.hk/