The webinar named “Digital twins for reducing testing and qualification
needed for safety assurance: Is the Microelectronics Industry Ready?” was
organized by Centre for Advances in Reliability and Safety (CAiRS) on 16th
Feb 2022. The speaker was Prof.
Abhijit Dasgupta (University of Maryland).
In the beginning, he briefed digital twin for developing reliable
products.
And he also mentioned the background of microelectronics industry and
its development history. Traditional
electronic packaging hierarchy was also discussed including wire bonding, ball
grid array and flip chip, 3D IC, etc.
Hybrid Integration (HI) concept such as Intel’s Embedde Multi-Die
Interconnect Bridge (EMID) was described and HI digital twins on complex
multi-physics multi-scale systems was discussed. And then raised “Reliable/Safe
HI system approach”.
After that Prof. Dasgupta mentioned the reliability/safety methodology
for HI system using both Top-Down Big Data Approach and Bottom-Up Physics
Approach to establish “Reliability Digitals Twins” for fusion prognostics.
Finally, a holistic approach on microelectronics reliability was
introduced and discussed the convergence of reliability-physics and AI.
Lastly,
different digital twins’ applications were discussed such as In-Situ Service
Load Monitoring for automotive life-cycles (driving Digital Twins),
Multi-Physics Degradation in Electronics (e.g. Capacitor, Batteries, Printed Hybrid
Electronics (PHEs), etc). So that digital twins would improve the whole supply
chain.
At the end, Prof. Abhijit Dasgupta briefed grad challenges for digital
twins on reliable/Safe microelectronics that were timely development, deployment,
and sustainment of reliable, safe, repairable, and affordable systems.
Reference:
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