IEEE-CPMT Hong Kong Chapter arranged a technical visit to Electronic Packaging Laboratory (EPACK Lab) and Jockey Club Controlled Environment Test Facility (JCCETF) in HKUST on 10 March 2017. By visiting EPack Lab, the latest development of Integrated circuit (IC) manufacturing process, mechanical reliability test, failure analysis, material characterization and long term reliability test. The JCCETF has achieved HOKLAS accreditation since 1999, the facility is a multi-test thermal and energy efficiency testing set-up for the testing of various home appliances such as air conditioners. I remembered that I was the consultancy to assist JCCETF to get the HOKLAS accreditation in 1998 when I served in CMATCL. The facility and environment was no changed. When we arrived at JCCETF, TM Lau (HKSTP) and Dr. George Lau (OUHK) and I took a photo in front of the testing facility.
Then the representative of JCCETF explained the testing and calibration requirement to us. I remembered that the psychometric type air-enthalpy setup needed for the testing of room air conditioners in according to the ISO 5150:1994.
The whole control room arrangement and facilities design was shown in the following diagram.
The testing unit and Dry/Wet bulb box were explained which needed to be calibrated before test. The sampling temperature is once per 5 min and total for 7 times, as well as, the conditioning time is about 1 hour in full loading.
In another control room, the air conditioner was under constant laminar flow for testing. It is because environment would affect air conditioner performance.
Then we took a group photo before went to the next laboratory.
In EPACK Lab, Dr. Jeffery Lo briefed their services including die sawing, decap and other chemical process of wafer, etc.
Some equipment for BGA Solder Ball Shear and Pull Tests were showed.
Small Scanning Electron Microscopy (SEM) was shown and he said they also had Scanning Acoustic Microscopy (SAM). It was found a good partner for inter-laboratory test with us. Moreover, some reliability chambers were introduced.
Finally, he introduced a sub-micron die-bonder for precision die attach and advanced chip packaging.
At the end, we took a group photo inside EPACK Lab.
EPACK Lab - http://ihome.ust.hk/~epack/homepage.htm
JCCETF (HOKLAS directory) - http://www.itc.gov.hk/en/quality/hkas/doc/scopes/124.pdf