IEEE-CPMT
Hong Kong Chapter arranged a technical visit to Electronic Packaging Laboratory
(EPACK Lab) and Jockey Club Controlled Environment Test Facility (JCCETF) in
HKUST on 10 March 2017. By visiting
EPack Lab, the latest development of Integrated circuit (IC) manufacturing
process, mechanical reliability test, failure analysis, material
characterization and long term reliability test. The JCCETF has achieved HOKLAS accreditation
since 1999, the facility is a multi-test thermal and energy efficiency testing
set-up for the testing of various home appliances such as air
conditioners. I remembered that I was
the consultancy to assist JCCETF to get the HOKLAS accreditation in 1998 when I
served in CMATCL. The facility and
environment was no changed. When we
arrived at JCCETF, TM Lau (HKSTP) and Dr. George Lau (OUHK) and I took a photo
in front of the testing facility.
Then the representative of JCCETF explained the testing and calibration requirement to us. I remembered that the psychometric type air-enthalpy setup needed for the testing of room air conditioners in according to the ISO 5150:1994.
The
whole control room arrangement and facilities design was shown in the following
diagram.
The
testing unit and Dry/Wet bulb box were explained which needed to be calibrated
before test. The sampling temperature is
once per 5 min and total for 7 times, as well as, the conditioning time is
about 1 hour in full loading.
Dry/Wet
bulb
In
another control room, the air conditioner was under constant laminar flow for
testing. It is because environment would
affect air conditioner performance.
Then
we took a group photo before went to the next laboratory.
In
EPACK Lab, Dr. Jeffery Lo briefed their services including die sawing, decap
and other chemical process of wafer, etc.
Some equipment for BGA Solder Ball Shear and Pull Tests were showed.
Small
Scanning Electron Microscopy (SEM) was shown and he said they also had Scanning
Acoustic Microscopy (SAM). It was found
a good partner for inter-laboratory test with us. Moreover, some reliability chambers were
introduced.
Finally, he introduced a sub-micron die-bonder for precision die attach and advanced chip packaging.
At the end, we took a group photo inside EPACK Lab.
Reference:
EPACK Lab - http://ihome.ust.hk/~epack/homepage.htm
JCCETF (HOKLAS directory) - http://www.itc.gov.hk/en/quality/hkas/doc/scopes/124.pdf
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