CAiRS Lecture - Digital twins for reducing testing and qualification needed for safety assurance

The webinar named “Digital twins for reducing testing and qualification needed for safety assurance: Is the Microelectronics Industry Ready?” was organized by Centre for Advances in Reliability and Safety (CAiRS) on 16^th Feb 2022.  The speaker was Prof. Abhijit Dasgupta (University of Maryland). 

In the beginning, he briefed digital twin for developing reliable products.

And he also mentioned the background of microelectronics industry and its development history.  Traditional electronic packaging hierarchy was also discussed including wire bonding, ball grid array and flip chip, 3D IC, etc.

Hybrid Integration (HI) concept such as Intel’s Embedde Multi-Die Interconnect Bridge (EMID) was described and HI digital twins on complex multi-physics multi-scale systems was discussed. And then raised “Reliable/Safe HI system approach”.

After that Prof. Dasgupta mentioned the reliability/safety methodology for HI system using both Top-Down Big Data Approach and Bottom-Up Physics Approach to establish “Reliability Digitals Twins” for fusion prognostics.

Finally, a holistic approach on microelectronics reliability was introduced and discussed the convergence of reliability-physics and AI.

Lastly, different digital twins’ applications were discussed such as In-Situ Service Load Monitoring for automotive life-cycles (driving Digital Twins), Multi-Physics Degradation in Electronics (e.g. Capacitor, Batteries, Printed Hybrid Electronics (PHEs), etc). So that digital twins would improve the whole supply chain.

At the end, Prof. Abhijit Dasgupta briefed grad challenges for digital twins on reliable/Safe microelectronics that were timely development, deployment, and sustainment of reliable, safe, repairable, and affordable systems.

Reference:

CAiRS - https://www.cairs.hk/view/index.php