The seminar entitled "Power Electronic Packaging and 3D Sensing & Connect SiP for IoT" was co-organized by Hong Kong Science & Technology Park Corporation (HKSTPC) and Hong Kong Applied Science and Technology Research Institute (ASTRI) on 31 Aug 2012.
Dr. Ivan Sham explained that power semiconductors are semiconductor devices mainly used in the circuits of inverters/converters for switchig and converting of electricity and controlling of motors. It included power MOSFET, diodes, IGBT, bipolar transistors, and SiC devices, etc. Then he briefed the market trends of Power Semiconductors which was driven by energy-saving standards, wind power generation and HV/EVs. Dr. Sham said Insulated-gate bipolar transistor (IGBT) markets were growing dramatically in the upcoming few years, particularly from the demands of Green Technologies.
Key challenges and issues of product development were substrate and module design for superior electrical and thermal performance. Moreover, transient electro-thermo-mechanical multi-coupling simulation for accurate prediction for reliability estimation was needed. Thermal design was very important and it depended on cerarmic types of substrate, solder layer, thermal interface material properties and cooling condition.
Finally, Dr. Sham introduced the next generation power module solution which was developing by ASTRI involved DBC design, wirebondless technology and heat dissipation. It was expected to enhance heat dissipation from 40% to 70% and to extend of die attach lifetime upto 3 times; as well as, to reduce the parasitic inductance and resistance of wirebond interconnect upto 99% and 85%, respectively.
The second speaker was Mr. Steve He (Senior Manager, Advanced Packaging Technologies, ASTRI) and his topic named "3D Sensing & Connecting SiP for Internet of Things: Challenges and Opportunities".
Firstly, Mr. Steve He mentioned the definition of Internet of Things (IoT) that uniquely identifiable objects (things) and their virtual representations in an Internet-like structure. It was very difficult to understand in English definition but in Chinese was obviously (物聯網就是物物相連的互聯網。). It had three key components of IoT that were "Sensing", "Connecting" and "Processing".
Mr. Steve He said the 3rd IT wave after PC & Internet was IoT. The following diagram showed the distribution of IoT R&D centers in China.
At the end, Mr. He introduced some typical applications such as Anti-counterfeit, Food Safety, Mobile Payment, Smart Home and Ambulance. He also showed how 3D System in Package (SiP) as a solution to reduce the size of chips.
Reference:
HKSTP Laboratories - http://lab.hkstp.org/default2.asp
ASTRI - http://www.astri.org/main/
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